Samsung’s upcoming S23 flagship series is set to be unveiled at the company’s Unpacked event on February 1st, and thanks to an alleged spec leak shared by WinFuture, we already know a lot about the device.
The most interesting of the leaks is the fact that Samsung will use a special version of Qualcomm’s Snapdragon 8 Gen 2 chipset in its S23 devices.
It’s worth noting that Samsung has sold its devices with Snapdragon chips in Canada, the United States and other key markets, whereas other markets, primarily Europe, have been stuck on inferior Exynos Samsung devices. Then, last year, Samsung and Qualcomm reportedly struck a deal that would result in the S23 series using Snapdragon chips globally, and that seems to be coming true now.
According to documentation viewed by 9to5Google, the chip used in the upcoming flagships will be called “Qualcomm Snapdragon 8 Gen 2 Mobile Platform for Galaxy.” According to the same documentation and the spec leak from WinFuture,, the chip will have a clock speed of up to 3.36GHz, whereas Qualcomm’s main version of the chip operates at 3.2GHz. Apart from that, the chipset isn’t expected to offer any other additional features, but it is sure to be optimized specifically for Samsung devices.
It’s alsoworth noting is that the chip will reportedly be manufactured by Samsung instead of TSMC (Taiwan Semiconductor Manufacturing Company) , which normally creates Qualcomm chips.
From what we already know, the regular S23 is expected to feature a 6.1-inch Gorilla Glass Victus 2 AMOLED display with a 2340 x 1080 pixel resolution, while the S23+ sports the same display specs, but offers a bigger 6.6-inch display. The S23 Ultra, on the other hand, comes with a 6.8-inch 3080 x 1440 display that can adjust between 1Hz and 120Hz and uses Victus 2. Find out more leaked specs about the upcoming flagships here.
Image credit: WinFuture
Source: WinFuture Via: 9to5Google
HBC says its e-commerce site will launch simultaneously with its retail locations sometime in the spring of 2023. 
Further, Apple confirmed that the new HomePod runs on the S7 chip, while the original 2018 HomePod ran on the A8 chip, which was also used in the iPhone 6. According to Apple, the new chip allows the smart speaker to enable software and system-sensing technology, offering advanced computational audio.
Just like the last-gen HomePod, two or more second-gen HomePods can be paired together with AirPlay to play music in sync, play different songs on different HomePod speakers, or even use them as an intercom to broadcast messages to other rooms. “Users can also create a stereo pair with two HomePod speakers in the same space. In addition to separating the left and right channels, a stereo pair plays each channel in perfect harmony, creating a wider, more immersive soundstage than traditional stereo speakers for a truly standout listening experience,” writes Apple in the device’s press release. It’s worth noting that a 1st-Gen HomePod can not be paired with a second-gen HomePod.
There’s also a new built-in temperature and humidity sensor that allows you to measure the climate inside your house. Paired with smart accessories like blinds and fans paired with the HomePod, the smart speaker can automatically either open or close the blinds, or turn on/off the fans depending on pre-determined temperature conditions. These automations can either be created on the Home app or through Siri voice commands.